India, Jan. 12 -- CES 2026, the most powerful tech event in the world, wrapped up four days of innovators showing up. The largest post-pandemic CES welcomed more than 148,000 attendees from around the... Read More
India, Jan. 12 -- Autolink, a global pioneer in next-generation automotive electronic/electrical (E/E) architecture and intelligent vehicle computing platforms, signed a Memorandum of Understanding (M... Read More
India, Jan. 12 -- Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an... Read More
India, Jan. 12 -- Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, d... Read More
India, Jan. 12 -- Microchip Technology has announced the release of custom-designed firmware for its MEC1723 Embedded Controller (EC), specifically tailored to support NVIDIA DGX Spark personal AI sup... Read More
India, Jan. 9 -- In late 2025, the global semiconductor ecosystem was experiencing an unprecedented memory chip shortage with knock-on effects for the device manufacturers and end users that could per... Read More
India, Jan. 9 -- At a 5.19% CAGR, the U.S. semiconductor supply chain market is projected to expand from USD 77.20 billion in 2025E to USD 115.44 billion by 2033, driven by strong domestic manufacturi... Read More
India, Jan. 9 -- TrendForce's recent investigations indicate that Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps. This c... Read More
India, Jan. 9 -- At CES 2026, PepsiCo announced a multi-year, industry-first collaboration with Siemens and NVIDIA to transform plant and supply chain operations through advanced digital twin technolo... Read More
India, Jan. 8 -- TrendForce's latest investigations indicate that DRAM suppliers in 1Q26 will continue to reallocate advanced process nodes and new capacity toward server and HBM products to support r... Read More